Electronic device for testing bonding wire integrity
US5909034A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 1996 |
| Grant date | Jun 1, 1999 |
| Priority date | — |
| Expiry date | May 17, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device presenting pairs of split contact pad portions, each pair of pads having multiple bonding wire, and metal connecting strips associated therewith. The end portion of the metal connecting strips being split into parallel strip segments, each connected to a respective contact pad, so as to form a plurality of parallel current paths between a node and an external contact pin connected to the node. When current is supplied along the connecting strip a voltage drop along each segment connected to a sound bonding wire is produced, but not along the segments connected to broken or non-bonded wires. By determining the existence of a voltage difference between the contact pad portions, it is possible to detect the interruption of one or more of the bonding wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.