Lead frame and method for manufacturing same
US5909053A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 1996 |
| Grant date | Jun 1, 1999 |
| Priority date | — |
| Expiry date | Dec 9, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3421
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method for manufacturing a lead frame, a predetermined pattern is formed on a matrix 10 by a resist, an electro-deposition portion is provided in a cavity formed in the resist patterns 12, and the electrodeposition pattern 13 is separated from the matrix 10. The resist pattern is formed on the matrix 10 so that a cavity portion 17 connecting a plurality of cavity 16 ends for inner lead formation can be included in the resist pattern, and an electro-deposition portion is provided into the cavity portion 17 so that the electro-deposition pattern 13 can be formed into a configuration in which the tip ends of the inner leads 22 are connected by a connecting piece 21, and the electro-deposition pattern 13 is separated from the matrix 10 while the tip ends of the inner leads 22 are connected by the connecting piece 21.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.