Method and apparatus for forming solder on a substrate
US5909634A · kind A · utility
18Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1997 |
| Grant date | Jun 1, 1999 |
| Priority date | — |
| Expiry date | Dec 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0531
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention discloses a method for forming solder (114) on a substrate (112). The method includes forming a decal (110) with a plurality of solder regions (113). The method further comprises aligning the decal (110) with the substrate (112) and transferring the solder regions (113) on the decal (110) to the substrate (112).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.