Electroless nickel plating solution and method
US5910340A · kind A · utility
255Cited by
9References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1997 |
| Grant date | Jun 8, 1999 |
| Priority date | — |
| Expiry date | Sep 17, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/42
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
To an electroless nickel plating solution comprising a water-soluble nickel salt, a reducing agent, and a complexing agent is added a polythionate or dithionite. The invention also provides a high-build electroless gold plating method comprising the steps of immersing a workpiece in the electroless nickel plating bath, thereby chemically depositing a nickel coating on the workpiece, and immersing the nickel-plated workpiece in an electroless gold plating bath, thereby chemically depositing a gold coating on the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.