Metallurgical interconnect composite
US5910354A · kind A · utility
10Cited by
4References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1997 |
| Grant date | Jun 8, 1999 |
| Priority date | — |
| Expiry date | Mar 4, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31544
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metallurgical interconnect composite is provided defined by a compliant, metallurgical, open cell, porous substrate which has a plurality of Z-axis conductive pathways extending from one side of the substrate to the other side. Each conductive pathway terminates in a solder covered surface area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.