Laminate circuit board with selectable connections between wiring layers
US5910755A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1997 |
| Grant date | Jun 8, 1999 |
| Priority date | — |
| Expiry date | Oct 28, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09945
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A laminate capacitor circuit board which permits constants of various kinds of circuit elements to be set by selectively effected connections between wiring layers, and a laminate capacitor circuit board which permits distributed circuit constants in a high-frequency wiring layer sandwiched between two shielding wiring layers to be set as desired. These circuits are formed with at least a pattern of a conductive foil on each dielectric layer, and include a plurality of wiring layers laminated one upon another, a wiring layer for connections laminated to a surface of the plurality of wiring layers laminated one upon another, a plurality of terminal patterns formed on the wiring layer for connections in a state insulated from each other, a plurality of vias for electrically connecting at least two of the plurality of terminal patterns to corresponding ones of the plurality of wiring layers, and connecting means for selectively connecting the plurality of terminal patterns to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.