Electronic stack module
US5910885A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 1997 |
| Grant date | Jun 8, 1999 |
| Priority date | — |
| Expiry date | Dec 3, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10386
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic stack module is disclosed comprising two or more substrates having upper and lower surfaces with one or more electronic components disposed on the surfaces and electrically connected to connector pads disposed in a predetermined pattern at the substrate edges. A plurality of clip leads are electrically attached to the connector pads, where each clip lead comprises a clip section, a standoff section of specified length, and a mounting section, the clip section configured to frictionally engage both upper and lower substrate surfaces. Stacking of substrates is accomplished by aligning and bonding clip sections of one substrate to corresponding mating sections of the adjacent substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.