Patent · US Expired

Strain relief apparatus and methods therefor

US5911596A · kind A · utility

6Cited by
4References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 4, 1997
Grant dateJun 15, 1999
Priority date
Expiry dateFeb 4, 2017

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01R12/772
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

An apparatus for securing a conductor to a circuit board. The conductor is configured for being soldered to the circuit board through a first aperture in the board. The apparatus includes a conductor supporting portion having a second aperture therethrough. The conductor supporting portion is configured for coupling to the circuit board. The second aperture substantially aligns with the first aperture when the conductor supporting portion is coupled to the circuit board to permit the conductor to be inserted through both the first aperture and the second aperture. The apparatus includes a tab portion configured for coupling to the conductor supporting portion. A portion of the conductor is thus held substantially immobile between the conductor supporting portion and a first edge of the tab portion when the tab portion is coupled with the conductor supporting portion, thereby preventing the conductor from being broken at the portion of the conductor when the conductor is flexed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.