Thermal interface with adhesive
US5912805A · kind A · utility
Inventors
Key dates
| Filing date | Nov 4, 1998 |
| Grant date | Jun 15, 1999 |
| Priority date | — |
| Expiry date | Nov 4, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/28
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises first and second generally planar substrates that are compressively bonded to one another. The first substrate has outer periphery that defines a first continuous peripheral edge. The second substrate has an outer periphery that defines a second continuous peripheral edge with at least a portion thereof extending beyond the first peripheral edge of the first substrate. An adhesive is deposited upon the portion of the second substrate extending beyond the peripheral edge of the first substrate, and preferably beyond the interface surface between the electronic component and the heat sink such that the thermal interface may be adhesively secured into position without forming an additional layer therebetween. Layers of conformable heat-conducting material are formed upon the outwardly-facing opposed sides of the bonded substrates to enhance the heat transfer from the electronic component to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.