CMP polishing pad backside modifications for advantageous polishing results
US5913713A · kind A · utility
51Cited by
24References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 1997 |
| Grant date | Jun 22, 1999 |
| Priority date | — |
| Expiry date | Jul 31, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad and method of polishing with a chemical mechanical planarization apparatus includes providing a bulk polishing pad material having a front polishing surface side and a back side. The polishing pad further includes a polishing pad wear indicator for indicating a polishing pad wear during a life cycle of the polishing pad. The polishing pad wear indicator is formed on the back side of the bulk polishing pad material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.