Injection molded, heat-sealed housing and half-etched lead frame for oximeter sensor
US5913819A · kind A · utility
121Cited by
5References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 1997 |
| Grant date | Jun 22, 1999 |
| Priority date | — |
| Expiry date | Apr 7, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The present invention is directed to an oximeter sensor to measure the oxygen content of a patient's blood. The sensor can include a lead frame having different thicknesses, a sensor housing being molded from a common thermoplastic resin, and rib members in the housing for inhibiting shorting between adjacent traces of the lead frame. The present invention further includes a process for forming the sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.