Metallic housing for implant with recesses for eddy current reduction
US5913881A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1997 |
| Grant date | Jun 22, 1999 |
| Priority date | — |
| Expiry date | Oct 23, 2017 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2250/0001
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An implant for implanting into human tissue includes a hermetically sealed, metallic housing for enclosing electronic means inside the housing for a high-frequency, telemetric information transfer between a programming device and the implant. The implant additionally includes a head for connecting a stimulation line. The housing comprises a metallic wall including groove-shaped recesses arranged at least on an inside of the metallic wall and which reduce a thickness of the metallic wall so that in a region of the recesses on the housing wall a material thickness does not fall below that which is necessary under operating conditions to ensure that the housing is impermeable to fluids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.