Solventless hot melt process for the preparation of pressure sensitive adhesives
US5914157A · kind A · utility
18Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 1995 |
| Grant date | Jun 22, 1999 |
| Priority date | — |
| Expiry date | Aug 31, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/16
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The incorporation of a non-thermosettable phenolic tackifying resin surprisingly provides improved solvent free, hot melt processing of hydrocarbon elastomers with crosslinking promoters to form pressure sensitive adhesive tapes. The tapes advantageously have a desirable balance of the properties of resistance to slow rate peel and fast rate peel adhesion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.