Chip fuse and process for production thereof
US5914649A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1997 |
| Grant date | Jun 22, 1999 |
| Priority date | — |
| Expiry date | Dec 16, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H85/046
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A chip fuse comprising an organic resin-made insulating substrate, a pair of electrodes formed at terminals of said organic resin-made insulating substrate, current protecting element wiring portions and a current protecting element positioned between said pair of electrodes and housed in said organic resin-made insulating substrate, said current protecting element having a thickness of 3-8 .mu.m and being supported on an organic resin layer having a high tracking resistance, and at least one space being formed at least on the current protecting element side, does not cause ignition nor smoking and is excellent in clearing characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.