Electronic component mounting base board and method of producing the same
US5914859A · kind A · utility
12Cited by
8References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 22, 1997 |
| Grant date | Jun 22, 1999 |
| Priority date | — |
| Expiry date | Apr 22, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic component mounting base board comprises an insulating substrate provided with a mounting portion for mounting an electronic component and a heat-sink plate disposed on an lower surface of the insulating substrate, in which the insulating substrate is provided with a wiring pattern for signal or power, a grounding pattern and a grounding hole, and the grounding hole is provided on its inner wall with a metal plated film for electrically connecting to the grounding pattern and a solder is filled in an inside of the grounding hole for electrically connecting to the heat-sink plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.