Small volume heat sink/electronic assembly
US5914860A · kind A · utility
38Cited by
11References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 30, 1998 |
| Grant date | Jun 22, 1999 |
| Priority date | — |
| Expiry date | Sep 30, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20936
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink apparatus including a fluid conduit within a body portion wherein the body portion includes at least first and second walls which are in different planes, each wall forming at least one mounting surface, the conduit passing though each wall and, the apparatus also including at least two electronic devices, at least one device mounted to each of the mounting surfaces for dissipating heat, the assembly having a relatively small volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.