Method of mounting an electronic power component

US5915754A · kind A · utility

Assignee

• The Braun Corporation · DE

Inventors

• Hans Hiller · Friedrichsdorf, DE
• Martin Stratmann · Meerbusch, DE
• Wolfram Debus · Kronberg, DE
• Gunter Oppermann · Dietzenbach, DE
• Friedrich Werhahn · Marktheidenfeld, DE

Key dates

• Filing date: May 23, 1996
• Grant date: Jun 29, 1999
• Expiry date: May 23, 2016

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49144
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of mounting an electronic power component to a cooling element includes finishing at least a bonding area of the cooling element with a finish for use during soldering, forming an indentation in the bonding area of the cooling element, placing adhesive in the indentation, attaching the power component to the cooling element using the adhesive, and thereafter soldering the power component to the cooling element. The finishing melts during soldering and the adhesive prevents shifting of the power component on the cooling element during soldering. Alternatively, the power component is attached to a printed circuit board by adhesive bonding prior to soldering.