Wafer carrier for semiconductor wafer polishing machine
US5916015A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 25, 1997 |
| Grant date | Jun 29, 1999 |
| Priority date | — |
| Expiry date | Jul 25, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A carrier assembly for use in the processing of semiconductor wafers which avoids the use of a gimbal mechanism. The wafer carrier assembly comprises a backing pad for the wafer, with the wafer and backing pad secured within a retaining ring, such that the retaining ring, wafer, and backing pad move as single, integral assembly. A resiliently flexible outer housing terminates in a pad load ring transmits the rotation of the drive shaft to the load plate while allowing limited axial movement between the outer ring and inner ring assembly. The wafer/load plate assembly is permitted to float within the outer ring while the outer ring locally depresses the polishing pad near the wafer periphery, to mitigate edge exclusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.