Electronic wiring substrate with subminiature thru-holes
US5916425A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 1996 |
| Grant date | Jun 29, 1999 |
| Priority date | — |
| Expiry date | May 16, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N33/4925
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention is an electronic wiring substrate for sensors formed over a subminiature through hole. Because of the small diameter of the through hole, the material that fills the through hole and the through hole itself have an essentially negligible effect on the sensor. Only a small amount of conductive material which fills each through hole is in contact with each associated electrode. Therefore, the purity of the electrode is not significantly altered by the conductive material coupled to the electrode. A relatively large number of sensors can be formed on the surface of the substrate within a relatively small fluid flowcell. Thus, more information can be attained using less blood. The substrate is essentially impervious to aqueous electrolytes and blood over long periods of storage in potentially corrosive environments. Since the substrate does not break down or become unstable when exposed over time to such reactive environments, the isolation that is provided by the substrate remains very high between each sensor and each other sensor, between each sensor and each conduction path, and between each conduction path and each other conduction path. The superior isolatio…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.