Method and apparatus for dicing a substrate
US5916460A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 1996 |
| Grant date | Jun 29, 1999 |
| Priority date | — |
| Expiry date | Jul 5, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03B33/091
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser device dices a substrate by generating a continuous wave-oscillation laser beam 3 that is converged by a lens 4 and focused at a predetermined focus O between the surface of the substrate 1 and a tip of a nozzle of a guide 5. Then, the focus is expanded to result in a laser beam 3a having a beam spot diameter of S at the surface of the substrate 1. A flow of assist gas G.sub.0, G.sub.1, G.sub.2 having a predetermined constant pressure is supplied from a gas intake 6 surrounding the laser beam 3. As the laser beam 3a is defocused, the beam spot diameter S is expanded and its energy distribution is moderated. The gas is blown onto the substrate 1 at constant pressure in order to suppress generation of strains due to thermal deformation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.