Heat-curing, one-component adhesives which are based on polyurethanes, a process for their preparation, and their use
US5916629A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 1997 |
| Grant date | Jun 29, 1999 |
| Priority date | — |
| Expiry date | Jul 11, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31551
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Heat-curing one-component adhesives which are based on polyurethanes derived from A) a hardener component comprising polyaddition products containing hydroxyl and uretdione groups, B) a binder component comprising 1,2-epoxide compounds having more than one 1,2-epoxide group and one or more hydroxyl groups in the molecule, optionally C) further hydroxyl-containing compounds and optionally D) auxiliaries and additives known from adhesives technology; a process for preparing these compounds and to their use as heat-curing, one-component, solvent-free, thermally stable and solvent-resistant polyurethane (PU) adhesives which do not give off elimination products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.