Thermal head and method of manufacturing the same
US5917531A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1997 |
| Grant date | Jun 29, 1999 |
| Priority date | — |
| Expiry date | Oct 1, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/345
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal head of the present invention includes an insulating substrate (1), a bulging glaze layer (2) of amorphous glass formed on a surface of the insulating substrate (1), a heating resistor layer (5) formed on the bulging glaze layer (2), an electrode-carrying glaze layer (3) formed on the surface of the insulating substrate (1) to partially overlap the bulging glaze layer (2), and an electrode layer (4) formed on the electrode-carrying glaze layer (3) to partially overlap the heating resistor layer (5). Each of the bulging glaze layer (2) and the electrode-carrying glaze layer (3) is made of amorphous glass. The electrode-carrying glaze layer (3) has a smaller thickness than the bulging glaze layer (2). Thus, it is possible to bake the electrode-carrying glaze layer (3) at a lower temperature than the baking temperature for the bulging glaze layer (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.