Integrated circuit intercoupling component with heat sink
US5917703A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 17, 1998 |
| Grant date | Jun 29, 1999 |
| Priority date | — |
| Expiry date | Apr 17, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1433
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An intercoupling component (e.g., socket or adapter) is provided for increasing the dissipation of heat generated within an integrated circuit (IC) array positioned within the intercoupling component, while maintaining a relatively low profile. The intercoupling component includes a heat sink positioned within the package support member, and having an upper surface in contact with a lower surface of the integrated circuit package disposed within the package support member. The package support member includes contact terminals disposed within associated openings of the package for electrically connecting the contacting areas of the integrated circuit package to the corresponding connection regions of the substrate. The openings extend from an upper surface to an opposite lower surface of the support member and are located in a pattern corresponding to a pattern of the connection contacts. The heat sink may be configured to be removable and replaceable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.