Process for producing a semiconductor device using anisotropic conductive adhesive
US5918113A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 1997 |
| Grant date | Jun 29, 1999 |
| Priority date | — |
| Expiry date | Jul 16, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/321
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for producing a semiconductor device includes a step of forming an anisotropic conductive adhesive layer, which includes a thermoplastic or thermosetting resin and conductive powder dispersed therein, on a surface of a circuit board on which electrode terminal contacts are arranged so as to correspond to electrode terminals of a semiconductor chip which is to be mounted on said circuit board. Then, the anisotropic conductive adhesive layer is softened and the semiconductor chip is placed in such a manner that the electrode terminals coincide with the electrode terminal contacts through the anisotropic conductive adhesive layer. The semiconductor chip is heat-pressed against the circuit board so that the electrode terminals are electrically connected to the electrode terminal contacts and simultaneously the semiconductor chip is physically fixed to the circuit board when the anisotropic conductive adhesive layer is hardened.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.