Apparatus and method for filling a ball grid array
US5918792A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 1997 |
| Grant date | Jul 6, 1999 |
| Priority date | — |
| Expiry date | Apr 4, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/041
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The array of recesses in a ball grid array carrier or (device) are populated with solder balls through a closely spaced tooling plate or stencil which has a like array of apertures. A solder bin is moved along side rails over the stencil allowing solder balls to fill the apertures in the stencil settling on the corresponding recesses and held there by adhesive. Excess solder balls are moved along by the movement of the bin. The bin is held in close contact with the stencil to avoid misplacement of the balls by bowing the stencil and by forcing it into a plane coplanar with the bottom of the bin. Alternative techniques are magnetic or vacuum areas of the bottom of the bin to ensure complete contact with the stencil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.