Copper-foil having a protective layer and copper-clad laminates using same
US5919379A · kind A · utility
2Cited by
5References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 22, 1997 |
| Grant date | Jul 6, 1999 |
| Priority date | — |
| Expiry date | Dec 22, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12493
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Copper foil having a matte surface and an opposite shiny surface, the shiny surface having thereon a protective metallic coating comprised of a first protective metallic layer, preferably iron, electrodeposited on the shiny surface and a second metallic layer, preferably zinc, electrodeposited on the first layer, the metallic coating be chemically removable without damage to the copper foil and the second metallic layer being softer than the first metallic layer. The matte surface of the copper foil can be bonded to a dielectric material, and the protective metallic coating can be removed from the shiny surface by etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.