Fe-based alloy foil for liquid-phase diffusion bonding of Fe-based materials by enabling bonding in oxidizing atmospheres
US5919577A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 1998 |
| Grant date | Jul 6, 1999 |
| Priority date | — |
| Expiry date | Jan 30, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12431
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention provides an Fe-based alloy foil for liquid phase diffusion bonding of Fe-based material by enabling bonding in oxidizing atmospheres at relatively high bonding temperatures to minimize thermal influence on the base material (the material to be bonded) and, thereby, ensures production of a bonded joint having a uniform microstructure and a good bonded joint strength and enables reduction in the bonding time. The Fe-based alloy foil contains, as essential elements, one of 1.0 to 20.0% P and 1.0 to 20.0% B, 1.0 to 20.0% Si, and 0.1 to 20.0% V, in terms of atomic percentage, the balance substantially of Fe and unavoidable impurities, and has a thickness of 3.0 to 100 .mu.m. Alternatively, the Fe-based alloy foil contains, as essential elements, 1.0 to 20.0% P, 1.0 to 20.0% Si, and 0.1 to 20.0% V, and 1.0 to 20.0% B, in terms of atomic percentage, the balance substantially of Fe and unavoidable impurities, and has a thickness of 3.0 to 200 .mu.m. In accordance with need, one or more of Cr, Ni and Co and/or one or more of W, Nb and Ti are also contained in suitable amounts. The foil advantageously has a substantially amorphous crystallographic structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.