Epoxy resin moulding compounds having halogen-free flame retardation

US5919843A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Wolfgang von Gentzkow · Kleinsendelbach, DE
• Klaus Kretzschmar · Erlangen, DE
• Michael Schreyer · Weisendorf, DE
• Peter Donner · Espoo, FI

Key dates

• Filing date: Nov 21, 1997
• Grant date: Jul 6, 1999
• Expiry date: Nov 21, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Flame-resistantly formulated, flowable, latently reactive, phenolically curable epoxy-resin moulding compounds for the encapsulation of electronic components containing the following components: PA1 an epoxy-resin component obtained from a solvent-free reaction resin mixture of polyepoxy resin and polyisocyanate resin having a molar ratio of the epoxy groups to the isocyanate groups of 1.1 to 4 at a reaction temperature of up to 220.degree. C. in the presence of a reaction accelerator in a concentration of 0.5 to 2.5% and using triphenylphosphine oxide in a concentration of 0.05 to 10%, relative in each case to the reaction resin mixture, PA1 a hardener component containing at least two phenolic hydroxyl groups per molecule, PA1 inorganic filler, PA1 and standard additives.