Epoxy resin composition
US5919844A · kind A · utility
25Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1997 |
| Grant date | Jul 6, 1999 |
| Priority date | — |
| Expiry date | Aug 26, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is an epoxy resin composition suitable for sealing a semiconductor, comprising an epoxy resin (A), a hardener (B), an inorganic filler (C), and a phosphoric acid ester compound (D), an amount of the inorganic filler (C) contained being more than 80% by weight relative to the composition. A semiconductor sealing epoxy resin composition excellent in flame retardancy, formability, reliability and solder heat resistance is obtained without an essential need to use a halogen-based flame retardant or an antimony-based flame retardant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.