Apparatus for cooling electronic devices using a flexible coolant conduit
US5920457A · kind A · utility
28Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1996 |
| Grant date | Jul 6, 1999 |
| Priority date | — |
| Expiry date | Sep 25, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for cooling an electronic assembly. The electronic assembly is placed in thermal contact with a single, continuous and monolithic coolant conduit capable of housing a coolant. A plurality of removable cold plates are coupled to the conduit, through their indentation like openings along a peripheral edge of each plate. The conduit with plates is then bent as to complement the contour of the assembly to be cooled in a three dimensional manner as required.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.