IC package processing and measuring method and system therefor
US5920481A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1997 |
| Grant date | Jul 6, 1999 |
| Priority date | — |
| Expiry date | Nov 12, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC package processing and measuring system comprises: a processing and measuring device that executes processing or measurement on a prescribed number of IC packages juxtaposed in a prescribed area; a feed device that feeds IC packages into the prescribed area, a prescribed number at a time, by feeding with a prescribed feed pitch an IC package support on which are loaded a plurality of juxtaposed IC packages; and a control device that controls the processing and measuring device and feed device. The control device comprises position calculating means that uses shape data of the IC package and IC package support to calculate target positions of processing and measurement of the IC packages in the prescribed area and outputs the calculated position data to the processing and measuring device. The processing and measuring device comprises processing and measuring means that uses the target position data that were input from the position calculating means to execute processing or measurement on the IC packages that were fed into the prescribed area. Thus improvement of the operability and shortening of the operating time are attained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.