High-power diode laser and method for mounting the same
US5920584A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1997 |
| Grant date | Jul 6, 1999 |
| Priority date | — |
| Expiry date | Oct 23, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/024
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A high-power diode laser and a method for mounting same are described. Predetermined breaking locations in the laser bar are provided which, during cooling after the laser bar has been soldered to a heat sink having a smaller thermal expansion coefficient, lead to breakage at defined locations between the single laser diodes of the laser bar. As a result of the physical division of the laser bar, it is possible to use a solder which has low ductility (hard solder) at room temperature, since destruction of the single laser diodes of the laser bar as a result of mechanical stresses can be ruled out.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.