Patent · US Expired

High-power diode laser and method for mounting the same

US5920584A · kind A · utility

6Cited by
5References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 23, 1997
Grant dateJul 6, 1999
Priority date
Expiry dateOct 23, 2017

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01S5/024
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A high-power diode laser and a method for mounting same are described. Predetermined breaking locations in the laser bar are provided which, during cooling after the laser bar has been soldered to a heat sink having a smaller thermal expansion coefficient, lead to breakage at defined locations between the single laser diodes of the laser bar. As a result of the physical division of the laser bar, it is possible to use a solder which has low ductility (hard solder) at room temperature, since destruction of the single laser diodes of the laser bar as a result of mechanical stresses can be ruled out.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.