CVD diamond coated substrate for polishing pad conditioning head and method for making same
US5921856A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 15, 1998 |
| Grant date | Jul 13, 1999 |
| Priority date | — |
| Expiry date | Jun 15, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0018
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A flat substrate polishing pad conditioning head for a chemical-mechanical-planarization apparatus is provided which has been shown to double the useable life of a polishing pad used to planarize and/or polish both oxide and metal outer layers in the processing of semiconductor wafers and to provide for more uniform polishing during the life of the polishing pad. The polishing pad conditioning head (24) comprises a suitable substrate (26), a diamond grit (28) that is evenly distributed over the surface of the substrate (26) and a CVD diamond (30) grown onto the diamond grit (28) and the substrate (26) so that the diamond grit (28) becomes encased in the CVD diamond (30) and bonded to the surface of the substrate (26).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.