Conductor paste for plugging through-holes in ceramic circuit boards and a ceramic circuit board having this conductor paste
US5922245A · kind A · utility
15Cited by
15References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1997 |
| Grant date | Jul 13, 1999 |
| Priority date | — |
| Expiry date | Sep 3, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/256
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductor paste for plugging a through-hole in a ceramic substrate which includes an electrically conductive powder having a metal powder as its main component, a swelling agent and a vehicle, and may also include adhesion improvers. After sintering the conductor paste, a conductor plug is created which will not fall out of the through-hole, is resistant to chipping during the leveling process and may be gas impermeable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.