Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates
US5922453A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1997 |
| Grant date | Jul 13, 1999 |
| Priority date | — |
| Expiry date | Feb 6, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ceramic-filled fluoropolymer composite is presented, suitable for use as an electrical substrate material. In accordance with the present invention, a ceramic-filled fluoropolymer composite further comprises high temperature, high modulus, finely powdered polymeric material. The median particle size of the finely powdered polymeric material is less than about 200 .mu.m. The finely powdered polymeric material is further stable at temperatures greater than about 350.degree. C. Substitution of the finely powdered polymeric material for fluoropolymer matrix material within a fairly narrow concentration range results in a composite with enhanced flexural modulus, but no deleterious effect on dielectric loss. The composite material is plated or clad with conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.