Patent · US Expired

Patternless technique for building self-aligned floating gates

US5922619A · kind A · utility

3Cited by
5References
18Claims
0Family size

Assignee

Inventor

Key dates

Filing dateOct 2, 1997
Grant dateJul 13, 1999
Priority date
Expiry dateOct 2, 2017

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D30/0411

Abstract

A patternless, self-aligning method of forming a floating gate on a silicon wafer having a plurality of raised field oxide isolation structures. The method of the present invention includes depositing a polysilicon layer onto the silicon wafer and the raised field oxide isolation structures, depositing a polysilicon etch masking layer onto the polysilicon layer, and planarizing the polysilicon etch masking layer. The polysilicon etch masking layer is then etched to expose the polysilicon layer over the raised field oxide isolation structures. The exposed polysilicon layer is then etched to remove the polysilicon layer over the raised field oxide isolation structures. The remaining polysilicon etch masking layer is then removed, leaving a plurality of polysilicon regions covering the silicon wafer between the field oxide isolation structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.