Packaging technology for Schottky die
US5923083A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 1997 |
| Grant date | Jul 13, 1999 |
| Priority date | — |
| Expiry date | Mar 1, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hermetic packaging technology for silicon Schottky die or any other two terminal solderable die. The technology uses a pressed ceramic frame, solid metal pads, a solid metal disc, metal seal rings, and a direct high temperature solder bond to the die. There are no intermediate straps or wires used to connect the die to the metal pads. The die is actually part of the final package, or it can be said that the package is built around the die. The device is hermetically sealed for use in high reliability applications such as military or space programs. All materials used in the technology are matched for coefficient of thermal expansion (CTE).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.