Microelectronic package and fabrication thereof
US5923090A · kind A · utility
37Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 1997 |
| Grant date | Jul 13, 1999 |
| Priority date | — |
| Expiry date | May 19, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package comprising an integrated circuit chip and a flip chip solder bonded thereto is provided. The integrated circuit chip has circuitry over a major surface thereof and has peripheral wire or tab bond pads surrounding an array of C4 connection pads located over this major surface. A flip chip is solder bonded to the C4 connection pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.