Low mass in the acoustic path flexible circuit interconnect and method of manufacture thereof
US5923115A · kind A · utility
22Cited by
13References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 1996 |
| Grant date | Jul 13, 1999 |
| Priority date | — |
| Expiry date | Nov 22, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A low mass in the acoustic path flex circuit that has a thin metal layer in the acoustic path area and thicker electrical traces. The low mass flex circuit allows for mass termination of the signal and ground traces with the electrodes of the piezoelectric piezoelements. Regions that are to be diced are reduced in thickness to decrease the loading on the dicing blade during fabrication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.