No wire bond plate (NWBP) packaging architecture for two dimensional stacked diode laser arrays
US5923692A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 1996 |
| Grant date | Jul 13, 1999 |
| Priority date | — |
| Expiry date | Oct 24, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A high-power two-dimensional edge-emitting diode laser array comprises mounting modules, laser bars mounted on the modules, and protective caps mounted on the bars opposite the modules. The lasers are electrically connected in series through the modules and caps. The caps serve as laser bar protectors during the bar burn-in. The caps have grooves which compensate for tolerances in the thicknesses of the lasers, modules, and caps. The array is mounted on a base plate, and is in thermal communication with a heat sink. The caps and/or modules are thermal-expansion-matched to the laser bars. Eliminating the need for a wire bond plate allows shortening the modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.