Method of manufacturing ball grid arrays for improved testability
US5924003A · kind A · utility
21Cited by
10References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 14, 1997 |
| Grant date | Jul 13, 1999 |
| Priority date | — |
| Expiry date | Nov 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball grid array package for integrated circuit chips that is designed to facilitate testing. The balls are planarized with high precision to make electrical contact more accurate for testing. Contact, even on fine pitched arrays, can be readily made. A machine for planarizing the solder balls is disclosed. Also, a contact array, as well as a method of making the contact array are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.