Method of making mandrels and circuits therefrom
US5924193A · kind A · utility
13Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1997 |
| Grant date | Jul 20, 1999 |
| Priority date | — |
| Expiry date | Feb 10, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention generally includes a process in which a mandrel for semi-additive construction of circuitry is fabricated by laminating shim stock or foil of stainless steel onto a suitable deformable substrate such as a polyimide glass board. Dimples for making raised features on circuitry are formed in the mandrel with a tool. The use of shim stock makes the mandrel relatively light and suitable for automated processing similar to that used to construct circuits on circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.