Cooling device for electronic component
US5924481A · kind A · utility
19Cited by
10References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 20, 1996 |
| Grant date | Jul 20, 1999 |
| Priority date | — |
| Expiry date | Jun 20, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A header tank for accommodating refrigerant is formed on one side of the cold plate, on the other side of which an electronic component is mounted. A plurality of loop pipes in which the refrigerant is circulated are connected with the header tank. The plurality of loop pipes are arranged substantially parallel with the cold plate. The radiating area of the loop pipes distant from the cold plate is larger than the radiating area of the loop pipes close to the cold plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.