Patent · US Expired

Single-cast, high-temperature thin wall structures having a high conductivity member connecting the walls and methods of making the same

US5924483A · kind A · utility

21Cited by
87References
43Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJul 18, 1997
Grant dateJul 20, 1999
Priority date
Expiry dateJul 18, 2017

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02T50/60
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

Disclosed is an integral single-cast multi wall structure including a very thin wall and a second thin wall. There is a passageway interposed between the pair of walls of the structure, and a high thermal conductivity member extends into said passageways and thermally couples the walls. The high thermal conductivity member increases the heat transfer between the walls of the structure. The present invention further includes a method for casting an integral structure having very thin walls that utilizes the high thermally conductive member in the casting process to hold the pattern and cores in alignment.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.