Nozzle and method for extruding conductive paste into high aspect ratio openings
US5925414A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1997 |
| Grant date | Jul 20, 1999 |
| Priority date | — |
| Expiry date | Feb 12, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A nozzle apparatus and method of use for extruding a conductive paste through a stencil or screen onto a substrate are disclosed. The nozzle includes a body and a conformable insert for contacting the screen. The method comprises the steps of obtaining a substrate and a patterned screen, contacting the screen with a nozzle comprising a nozzle body and a conformable nozzle insert, and extruding a paste through the nozzle and screen onto the substrate. The apparatus and method are particularly useful for producing patterned lines from extruded pastes in the manufacture of microelectronic components, and are even more particularly adapted for use in producing patterns in substrates having high aspect ratio openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.