Power block assembly and method of making same

US5926372A · kind A · utility

Assignees

• Ford Global Technologies, LLC · US
• Semipower Systems Inc. · US

Inventors

• Lawrence E. Rinehart · Lake Oswego, US
• Venkateswara Anand Sankaran · Farmington Hills, US
• Walter Noll

Key dates

• Filing date: Dec 23, 1997
• Grant date: Jul 20, 1999
• Expiry date: Dec 23, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D62/117
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A substrate assembly for use with a high power switching module includes at least one power block having a base plate for providing mechanical rigidity for the power block. The power block also includes at least one silicon die mounted onto the base plate and configured to form at least one high power switching transistor having leads extending away therefrom. The power blocks are then supportably mounted into corresponding apertures in a rigid frame which mounts the power switching module onto a heat dissipating surface and tested independently before mounting into the frame at full load current and power, which cannot be performed at the bare die level.