Vertical polishing device and method
US5928062A · kind A · utility
10Cited by
22References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1997 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | Apr 30, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/107
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a chemical mechanical polishing (CMP) machine and method in which at least one polishing device is provided with a vertically-oriented polishing surface and a slurry delivery mechanism. As a result, the footprint of the machine is greatly reduced and the prevention of contaminants embedding in the polishing device can be promoted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.