Patent · US Expired

Means for controlling thermal properties of AMTEC cells

US5928436A · kind A · utility

26Cited by
22References
24Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 26, 1997
Grant dateJul 27, 1999
Priority date
Expiry dateFeb 26, 2017

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH02N3/00
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

The present invention provides an AMTEC cell having a more robust power conductance path (conduction, radiation, convection, and latent heat transfer) from the heat input surface of the cell to the working fluid, evaporation surface, and SES. More particularly, one embodiment of the present invention includes collars, post and/or bridges extending between the SES support plate and the heat input surface. In another embodiment, a plurality of channels or conduits extend between the heat input surface and SES support plate. These embodiments simultaneously increase the thermal conductance path between the heat input surface of the cell and the evaporation surface as well as between the heat input surface of the cell and the SES, and enables superheating of the working fluid. Additionally, posts, fins or heat pipes may be provided in the low pressure zone of the cell between members of the SES to simultaneously increase the conductance between the heat input surface of the cell and the evaporation surface, raise the temperature of the SES, through radiation and/or conduction heat transfer, and isothermalize the SES. Furthermore, posts, fins, or heat pipes may extend from the heat inpu…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.