Dowel adhesive method for repair of ceramic matrix composites
US5928448A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 1, 1997 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | Nov 1, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/20
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention is a dowel-adhesive method for repairing ceramic matrix composites. The dowel adhesive method embodied in the present invention incorporates both adhesive and mechanical bonding of a patch to a damaged CMC surface area. The damaged area is first identified and then pre-processed. Next, a CMC patch plug is produced and adhesively and mechanically bonded to the pre-processed area. Mechanical bonding is accomplished with dowel pins and corresponding dowel pin holes in the patch plug and the panel. The dowel pins anchor the CMC patch plug to the panel. Adhesive bonding is accomplished by placing a ceramic adhesive between the patch plug and the panel. Also, the dowel pins are adhesively bonded within the dowel pin holes of the plug and the panel. The ceramic adhesive is set by a low temperature cure (if required) and a high temperature firing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.