Method for manufacturing a substrate having an irregular shape
US5928526A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 29, 1997 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | Apr 29, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0029
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for a substrate having an irregular shape is provided. Using a laser, a first series of laser drilled wells, having a first spacing, are made in the substrate material to define a substantial portion of the perimeter of the irregular shaped substrate. a second series of laser drilled wells, having a second spacing are made in the substrate material to form the remaining portion of the perimeter of the irregular shaped substrate. The second series of laser drilled wells form a "tab" which provides a more rigid tack to the substrate material thereby giving greater adhesion of the substrate to the panel of substrate material, wherein the irregular shaped substrate is retained in the panel of substrate material without breaking. Upon completion of processing, the irregular shaped substrates are easily removed from the panel. Also provided is an irregular shaped substrate comprising a substrate having a perimeter with at least one rounded corner and wherein the perimeter does not substantially form a square.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.